barrier layer
英 [ˈbæriə(r) ˈleɪə(r)]
美 [ˈbæriər ler]
封锁层；阻挡层
双语例句
- It is proved that alumina nano-fibers are formed from the porous layer, while totally different behaviors of the barrier layer a.
结果表明，纳米氧化铝纤维是在阳极氧化铝的多孔层形成的，且在浸溃过程中阻挡层和多孔层表现出完全不同的溶解趋势。 - Diurnal evolution of the barrier layer and its local feedback in the central Taiwan Strait
台湾海峡中部障碍层日变化及其局地反馈 - Apply PVD Process Instead of CVD to Deposit TIN Barrier Layer in Semiconductor Manufacture
在半导体制造中使用物理气相沉积代替化学气相沉积来生长氮化钛阻挡层 - Seasonal variation of the water mass and the barrier layer along the PN section in the East China Sea and their possible relationship
东海PN断面障碍层和水团的季节变化特征及其可能联系 - Organic light-emitting-diodes by inserting C_ ( 60) as exciton barrier layer
C（60）作激子阻挡层的有机发光二极管 - In accordance with the drawbacks of traditional AuGeNi/ Au ohmic contacts, a new ohmic contacts system with TiN diffusion barrier layer is proposed.
针对传统AuGeNi/Au欧姆接触系统的缺点，提出了加TiN扩散阻挡层的新型欧姆接触系统。 - The V-t transients reflect the change of the barrier layer thickness.
对应的电压与时间关系曲线则反映了阻挡层厚度的变化。 - Seasonal Variation of the Barrier Layer in the South China Sea and Its Relationship to the Sea Surface Flux
南海障碍层的季节变化及其与海面通量的关系 - Vertical interconnect silicon via was made by KOH etching process. A SiO2 layer was deposited as the insulation layer, sputtering Ti/ Cu was applied for adhesion/ barrier layer and seed layer.
采用KOH刻蚀工艺制作硅垂直互连用通孔，淀积SiO2作为硅垂直互连的电绝缘层，溅射Ti和Cu分别作为Cu互连线的黏附层/扩散阻挡层和电镀种子层。 - The Effect of Chromic Acid Concentration on the Formation Process of the Barrier Layer of Anodic
铬酸浓度对铝阳极氧化多孔膜阻挡层形成过程的影响 - In AC electrical field, the stable homogeneous glow discharge will appear by using dielectric barrier layer and high-frequency power source.
在交流电场中，利用介质阻挡层和高频激励源，可获得稳定均匀的大气压下辉光放电。 - Though the barrier layer is discontinuous due to the presence of SiC particles, the porous layer can still form continuously on the interface of electrolyte and material, and the gaps in porous layer can be closed in subsequent sealing course.
虽然SiC颗粒的存在影响了阻挡层的连续性，但多孔层仍能在电解质/材料界面不断生成，并且多孔层上的孔隙可以在封孔过程中得以闭合。 - A set of high voltage power and coaxial cylinder_tube electrodes dielectric barrier discharge reactor are designed to study the influences of the diameter of the central electrode and the internal diameter of the dielectric barrier layer tube on the NO removal with the discharge non-thermal plasma.
设计了一套高压电源装置以及相应的同轴圆柱筒介质阻挡放电管，研究了放电管中心电极直径以及介质层管内径变化对放电冷等离子体去除NO的影响。 - AC impedance shows that the porous layer and the barrier layer in the oxide film become denser and the metal substance was protected.
交流阻抗谱测试结果表明：掺入稀土之后，表面发生腐蚀的趋向减弱。氧化膜的多孔层和阻挡层都得到了改善，变得更为致密，从而保护了金属基体。 - Based on the theory that the lower the free energy the more stable the system and the core-shell structural model, the formation mechanism of grain boundary barrier layer capacitors ( GBBLC) is discussed.
基于自由能越低越稳定原理和芯-壳结构模型，论述了晶粒边界型陶瓷电容器（GBBLC）的形成。 - Diffusion Barrier Layer and Application in Improving Ohmic Contact Reliability of Semiconductor Devices
提高半导体器件欧姆接触可靠性的扩散阻挡层及其应用 - Its operation is based on a quantum effect, i.e., single electron tunneling through the barrier layer between its electrode and Coulomb island.
这种器件的工作原理是单电子通过电极与库仑岛之间势垒层的隧道贯穿量子效应。 - Diffusion Barrier Layer in Ohmic Contact of Semiconductor Devices
半导体器件欧姆接触中的扩散阻挡层 - The moving and scatter of electrons are analyzed when they crossover grain boundary barrier layer.
分析了电子在越过晶间势垒时受到的散射情况。 - Study and Optimization of CMP Slurry Used to Tantalum Barrier Layer of Copper Interconnection in ULSI
ULSI铜多层布线中钽阻挡层CMP抛光液的研究与优化 - The shear failure of the various films was mainly at the Au bump inside or the interface between Ag layer and the barrier layer.
各种薄膜结构的剪切破坏主要发生在Au球内部和Ag层与阻挡层之间的界面处。 - Analysis of the blind defect, the defect occurs only in dense hole area, hole in the barrier layer are pushed into the surface processes and internal cavities.
对缺陷分析发现，这种缺陷只发生在密集深孔区域，深孔内的阻挡层被挤到表面形成突起，而内部形成空洞。 - A thin and dense LDC barrier layer of 10 μ m, which adhered strongly to the electrolyte, was successfully prepared by screen-printing method based on the systematic study of the slurry composition, screen-printing conditions and sintering procedure.
通过对浆料粘结剂、丝网印刷和烧结工艺的系统研究，采用丝网印刷法成功制备出一层厚约10μm、表面致密且与电解质结合紧密的LDC阻挡层薄膜。 - The barrier layer was compaction and had no hole. But the porous layer contained high density holes which were parallel each other and the hole apertures were the same.
阻挡层是致密和无孔的，多孔层则含有高密度的纳米级孔洞阵列，这些孔洞相互平行、孔径大小一致、分布均匀。 - The SEM graphs show that the barrier layer is close packed hexagon structure.
SEM表明阻挡层底部为密排六边形结构。 - Adding a Ti barrier layer can protect Ag film from oxidation when prepare Low-E films.
在制备复合膜时，通过添加阻挡层Ti层，可以达到保护Ag层的作用。 - The XRD results show that both of porous layer and barrier layer of AAO template are amorphous materials. 2.
XRD表明，模板的多孔层和阻挡层均为非晶态氧化铝构成。 - The result indicated that the porous Alumina membrane was made of two layer films which were one layer porous Alumina film in the surface of membrane and the other barrier layer inside.
结果表明，多孔氧化铝膜呈双层结构：外表层的多孔层和与之相接的阻挡层。